JPS5859863A - サ−マルヘツド - Google Patents
サ−マルヘツドInfo
- Publication number
- JPS5859863A JPS5859863A JP15880681A JP15880681A JPS5859863A JP S5859863 A JPS5859863 A JP S5859863A JP 15880681 A JP15880681 A JP 15880681A JP 15880681 A JP15880681 A JP 15880681A JP S5859863 A JPS5859863 A JP S5859863A
- Authority
- JP
- Japan
- Prior art keywords
- thermal head
- semiconductor
- semiconductor element
- substrate
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 28
- 238000010438 heat treatment Methods 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 239000012212 insulator Substances 0.000 claims abstract 4
- 230000001681 protective effect Effects 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 229920002050 silicone resin Polymers 0.000 abstract description 3
- 229910000679 solder Inorganic materials 0.000 abstract description 3
- 239000004593 Epoxy Substances 0.000 abstract description 2
- 238000009413 insulation Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 229920006122 polyamide resin Polymers 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 229920001296 polysiloxane Polymers 0.000 description 5
- 239000011810 insulating material Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Electronic Switches (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15880681A JPS5859863A (ja) | 1981-10-07 | 1981-10-07 | サ−マルヘツド |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15880681A JPS5859863A (ja) | 1981-10-07 | 1981-10-07 | サ−マルヘツド |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5859863A true JPS5859863A (ja) | 1983-04-09 |
JPS6223674B2 JPS6223674B2 (en]) | 1987-05-25 |
Family
ID=15679759
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15880681A Granted JPS5859863A (ja) | 1981-10-07 | 1981-10-07 | サ−マルヘツド |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5859863A (en]) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS605841U (ja) * | 1983-06-11 | 1985-01-16 | ロ−ム株式会社 | 熱印字ヘツド |
JPS60152439U (ja) * | 1984-03-21 | 1985-10-11 | ロ−ム株式会社 | サ−マルプリントヘツド |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD532269S1 (en) | 2005-02-02 | 2006-11-21 | Perry Kaye | Scissors |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53872A (en) * | 1976-06-24 | 1978-01-07 | Yokoyama Teruo | Gas breaker controller |
JPS5387238A (en) * | 1977-01-12 | 1978-08-01 | Toshiba Corp | Diode matrix heat sensitive heads combined in one body |
JPS5421854A (en) * | 1977-07-20 | 1979-02-19 | Toshiba Corp | Recording head |
-
1981
- 1981-10-07 JP JP15880681A patent/JPS5859863A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53872A (en) * | 1976-06-24 | 1978-01-07 | Yokoyama Teruo | Gas breaker controller |
JPS5387238A (en) * | 1977-01-12 | 1978-08-01 | Toshiba Corp | Diode matrix heat sensitive heads combined in one body |
JPS5421854A (en) * | 1977-07-20 | 1979-02-19 | Toshiba Corp | Recording head |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS605841U (ja) * | 1983-06-11 | 1985-01-16 | ロ−ム株式会社 | 熱印字ヘツド |
JPS60152439U (ja) * | 1984-03-21 | 1985-10-11 | ロ−ム株式会社 | サ−マルプリントヘツド |
Also Published As
Publication number | Publication date |
---|---|
JPS6223674B2 (en]) | 1987-05-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7560819B2 (en) | Semiconductor device and method of manufacture thereof, circuit board and electronic instrument | |
JP3061954B2 (ja) | 半導体装置 | |
KR101505551B1 (ko) | 온도 감지소자가 장착된 반도체 파워 모듈 패키지 및 그제조방법 | |
US4423435A (en) | Assembly of an electronic device on an insulative substrate | |
KR950024311A (ko) | 얇은 회로기판과 반도체 장치가 접합되어 있는 열전도성 지지부재를 갖춘 전자 패키지 | |
US4229758A (en) | Package for semiconductor devices with first and second metal layers on the substrate of said package | |
JPS5859863A (ja) | サ−マルヘツド | |
JPH02201949A (ja) | 半導体装置 | |
JPS5938075A (ja) | サ−マルヘツド | |
JP2817712B2 (ja) | 半導体装置及びその実装方法 | |
JPH09232366A (ja) | 半導体チップの実装装置及びその実装方法 | |
JPH06216306A (ja) | 半導体素子アセンブリ用内部キャパシタ配設構造およびその配設方法 | |
JP2914679B2 (ja) | 混成集積回路装置 | |
JP3721589B2 (ja) | 混成集積回路装置及びその製造方法 | |
JP2561409B2 (ja) | 感熱記録素子 | |
JPH0870057A (ja) | ハイブリッドic | |
JPH0739244Y2 (ja) | 混成集積回路装置 | |
JPS5938076A (ja) | サ−マルヘツド | |
JPS62252954A (ja) | 半導体装置 | |
JP2765265B2 (ja) | 半導体装置用リードフレーム | |
JP2900452B2 (ja) | 半導体集積回路 | |
JPS62239557A (ja) | 半導体装置 | |
JPS6123345A (ja) | 半導体装置 | |
JPS63137460A (ja) | 半導体チツプ搭載用プリント配線板 | |
JPH04159767A (ja) | 混成集積回路 |